Malaysia’s strategic push to evolve from a back-end assembly hub into a front-end semiconductor powerhouse marks a pivotal transition from “Made in Malaysia” to “Made by Malaysia.” Driven by the National Semiconductor Strategy (NSS) and accelerated by AI-driven chip demand, the country is expanding its traditional dominance in packaging and testing (ATP) toward integrated circuit (IC) design, advanced packaging, and intellectual property development. Concrete milestones—such as the national Arm Limited partnership aiming to produce homegrown chips by 2030 and targeted training initiatives for 60,000 skilled engineers—signal a structural realignment. By bridging capital access gaps and fostering local tech champions, Malaysia is positioning itself to capture higher-value nodes within the global electronics supply chain.
source : https://malaysia.news.yahoo.com/malaysia-chip-ambitions-assembly-hub-230000706.html